Brand: CEMEDINE
Model: Epoxy Resin Adhesive (Heat curing type) - EP138,EP106NL,EP116new,EP171,EP170,EP170-2,EP160,EP811
Product Name: One Component Epoxy Adhesives
Specifications:
Multi-purpose type
| EP138 | EP106NL | EP116新 | EP171 |
|---|
| Application / Properties / Features | High-viscosity non-sag type | Low-viscosity flow type | Low-viscosity flow type/High peel-resistant type | Low-temperature curing type |
|---|
| Type | One-Part Heat Curing Epoxy Adhesive |
|---|
| Base | Epoxy resin | Epoxy resin | Epoxy resin | Epoxy resin |
|---|
| Appearance | Light yellowish brown | Milky white | Gray | Light brown |
|---|
| Viscosity | Pa・s/23℃ | 240 | 22 | 10.7 | 50 |
|---|
| Density | g/cm3 | 1.4 | 1.18 | 1.2 | 1.19 |
|---|
| Standard curing conditions | 120℃×30min | 120℃×40min | 150℃×20min | 80℃×30min |
|---|
| 150℃×20min | 140℃×30min |
| 120℃×10min |
| Tensile Shear Strength | MPa | 25.6 | 24.1 | 30.4 | 22.1 |
|---|
| T-Peel Strength | N/mm | 3.06 | 3.48 | 4.6 | 0.2 |
|---|
| Cured properties | Hardness | Shore D | 88 | 84 | 80 | 87 |
|---|
| Glass transition temperature | ℃ | 122 | 91 | 96 | 83 |
|---|
| Elastic modulus | MPa |
|
|
| 1215 |
|---|
| Curing Shrinkage Rate | % |
|
|
| 0.53 |
|---|
| Water Absorption Ratio | % | 0.1 | 0.14 |
| 0.13 |
|---|
| Linear Expansion Coefficient | 5.7×10-5 | 7.8×10-5 | 7.6×10-5 | 6.0×10-5 |
|---|
| Electric Characteristics | Volume Resistivity | Ω・cm | 3.0×1015 | 2.6×1015 |
| 3.0×1015 |
|---|
| Surface Resistivity | Ω/sq |
|
|
| 6.6×1015 |
|---|
| Insulation Breakdown Voltage | kV/mm | 16< |
|
|
|
|---|
| Dielectric Constant | 100Hz | 4.7 |
|
| 3.6/1kHz |
|---|
| Dielectric Loss Tangent | 100Hz | 0.01 |
|
| 0.01/1kHz |
|---|
| Storage temperature | ℃ | 0~10 | 0~10 | 0~10 | 0~10 |
|---|
| Capacity | 1kg | 1kg | 1kg | 1kg |
|---|
| 3kg | 3kg | 20kg | 20kg |
Flexible type
| EP170 | EP170-2 |
|---|
| Application / Properties / Features | High peel-resistant type | High peel-resistant type /Non-sag type |
|---|
| Type | One-Part Heat Curing Epoxy Adhesive (Flexible type) |
|---|
| Base | Epoxy resin | Epoxy resin |
|---|
| Appearance | Light yellow | Light yellow |
|---|
| Viscosity | Pa・s/23℃ | 170 | 340 |
|---|
| Density | g/cm3 | 1.13 | 1.12 |
|---|
| Standard curing conditions | 110℃×60min | 110℃×60min |
|---|
| 120℃×30min | 120℃×30min |
| Tensile Shear Strength | MPa | 15.1 | 10.8 |
|---|
| T-Peel Strength | N/mm | 6.67 | 6.6 |
|---|
| Cured properties | Hardness | Shore D | 55 |
|
|---|
| Glass transition temperature | ℃ | 20 |
|
|---|
| Water Absorption Ratio | % | 0.23 |
|
|---|
| Linear Expansion Coefficient | 30×10-5 |
|
|---|
| Electric Characteristics | Volume Resistivity | Ω・cm | 3.0×1015 |
|
|---|
| Capacity | 1kg | 1kg |
|---|
Heat resistance type
| EP160 |
|---|
| Application / Properties / Features | Heat-resistant type /Medium viscosity |
|---|
| Type | One-Part Heat Curing Epoxy Adhesive |
|---|
| Base | Epoxy resin |
|---|
| Appearance | Light brown |
|---|
| Viscosity | Pa・s/23℃ | 100 |
|---|
| Density | g/cm3 | 1.16 |
|---|
| Standard curing conditions | 110℃×60min |
|---|
| 120℃×30min |
| Tensile Shear Strength | MPa | 16.8 |
|---|
| T-Peel Strength | N/mm | 1.18 |
|---|
| Cured properties | Hardness | Shore D | 85 |
|---|
| Glass transition temperature | ℃ | 140 |
|---|
| Elastic modulus | MPa | 414 |
|---|
| Breaking Strength | N/mm2 | 22.6 |
|---|
| Elongation At Break | % |
|
|---|
| Curing Shrinkage Rate | % | 2.43 |
|---|
| Water Absorption Ratio | % | 0.05 |
|---|
| Linear Expansion Coefficient | 6.5×10-5 |
|---|
| Electric Characteristics | Volume Resistivity | Ω・cm | 2.6×1015 |
|---|
| Surface Resistivity | Ω/sq |
|
|---|
| Insulation Breakdown Voltage | kV/mm |
|
|---|
| Dielectric Constant | 100Hz | 4.5 |
|---|
| Dielectric Loss Tangent | 100Hz | 0.011 (1kHz) |
|---|
| Capacity | 1kg |
|---|
Potting electronics
| EP811 |
|---|
| Application / Properties / Features | Flow type |
|---|
| Type | One-Part Heat Curing Epoxy Adhesive |
|---|
| Base | Epoxy resin |
|---|
| Appearance | Black |
|---|
| Viscosity | Pa・s/23℃ | 82 |
|---|
| Density | g/cm3 | 1.71 |
|---|
| Standard curing conditions | 120℃×30min |
|---|
| Tensile Shear Strength | MPa | 19.7 |
|---|
| Cured properties | Hardness | Shore D | 91 |
|---|
| Glass transition temperature | ℃ | 134 |
|---|
| Elastic modulus | MPa | 6600 |
|---|
| Poisson's ratio |
| 0.3 |
|---|
| Breaking Strength | MPa | 59 |
|---|
| Elongation At Break | % | 1.19 |
|---|
| Water Absorption Ratio | % | 0.05 |
|---|
| Linear Expansion Coefficient | 25 |
|---|
| Electric Characteristics | Volume Resistivity | Ω・cm | 5.0×1015 |
|---|
| Insulation Breakdown Voltage | kV/mm | 22< |
|---|
| Dielectric Constant | 100Hz | 5.2 |
|---|
| Dielectric Loss Tangent | 100Hz | 0.1 |
|---|
| Capacity | 4kg |
|---|
| 10kg |